Product Introduction: Antistatic ABS GF30 Reinforced Injection Grade
Key Features: Permanent Antistatic, High Rigidity, Dimensional Stability, Dust-Proof & Explosion-Proof
1. Product Overview
Antistatic ABS GF30 is a functional composite material based on ABS resin, reinforced with 30% surface-treated short-cut glass fibers (GF) and integrated with high-performance antistatic additives.
This material is engineered to address two critical challenges in precision engineering: Electrostatic Discharge (ESD) hazards and insufficient structural rigidity. It effectively prevents charge accumulation—eliminating dust adsorption and explosion risks—while maintaining exceptional physical strength and precision under high loads.
2. Core Advantages
Permanent ESD Protection: Surface resistivity is stabilized within the range of 10^6 to 10^9 ohm/sq. The antistatic effect is independent of environmental humidity and will not degrade due to surface wear or cleaning.
High Rigidity & Strength: The 30% glass fiber reinforcement significantly enhances the flexural modulus and tensile strength, allowing it to replace aluminum alloys or die-cast parts in weight-sensitive precision equipment.
Low Shrinkage & Dimensional Stability: The addition of GF drastically reduces the injection molding shrinkage rate (0.1% - 0.3%), minimizing warping and ensuring a perfect fit for complex electronic housings.
Superior Dust-Proof Effect: By rapidly dissipating surface static charges, it prevents the adsorption of fine airborne dust particles, maintaining the cleanliness of internal sensitive components.
Explosion-Proof Safety: In environments with flammable or explosive gas mixtures, it prevents ignition caused by electrostatic sparks, complying with strict industrial and mining explosion-proof standards.
3. Technical Data Sheet (Typical Values)
Property | Test Method | Unit | Typical Value |
Surface Resistivity | ASTM D257 | ohm/sq | 10^6 - 10^9 |
Density | ISO 1183 | g/cm3 | 1.28 - 1.35 |
Glass Fiber Content | — | % | 30% |
Flexural Modulus | ISO 178 | MPa | 6,500 - 8,500 |
Notched Impact Strength | ISO 180 | kJ/m2 | 6 - 10 |
Heat Deflection Temp | ISO 75 (1.8MPa) | Celsius | 95 - 105 |
Molding Shrinkage | — | % | 0.1% - 0.3% |
4. Application Fields
I. Precision Electronic Housings & Frames
Applications: Oscilloscope housings, medical diagnostic equipment covers, semiconductor test fixtures, and high-end sensor enclosures.
Benefit: Protects internal circuitry from ESD strikes while providing a rugged physical shell that prevents signal distortion caused by structural deformation.
II. Explosion-Proof Industrial Gear
Applications: Handheld explosion-proof terminals, monitoring equipment for gas stations, and mining communication device shells.
Benefit: Meets explosion-proof certification requirements by eliminating spark hazards from friction-induced static electricity.
III. Semiconductor Manufacturing & Storage
Applications: Wafer carrier components, IC trays, and cleanroom workstation parts.
Benefit: Prevents particle contamination through its superior dust-proof properties, significantly improving production yields.
5. Injection Molding Recommendations
Drying: Recommended at 80-90 degrees Celsius for 3-4 hours.
Melt Temperature: 220 - 250 degrees Celsius. Avoid excessive heat to prevent the degradation of the antistatic additives.
Mold Temperature: 60 - 90 degrees Celsius. Higher mold temperatures help reduce "floating fibers" and improve surface finish.
Injection Pressure: Use medium-to-high injection pressure but control shear rates to avoid excessive fiber breakage.
